Bare-PCB memory with no heat spreader, built for office desktops and bulk system integrators. Reliable, inexpensive, no overclocking headroom.
Kit: 8GB (1x8GB) DDR3 at 1600 MHz, CAS latency CL11. Finish: Black. Form factor: 288-pin DIMM (desktop).
Rated speed requires enabling XMP 2.0 in BIOS; the kit boots at JEDEC 1333 MHz until you do.
Seller note: check the vX.XX version code on the module label — v3.xx is Micron, v4.xx is Samsung, v5.xx is SK Hynix. Samsung B-die (v4.31/v4.32) DDR4 and Hynix DDR5 sticks are the ones overclockers pay extra for.
Condition and exact IC revision are verified before listing goes active.